PU 2KF 09

PU 2KF 09 is a two components foam which has polyurethane as basis, is grey white, polymerizes itself at room temperature in a few seconds.

Thanks to its versatility, PU 2KF 09 is used to bind, to fill, to paste and to isolate many different substrates. The principal applications are: installation and heat insulation of door and window fixtures, thermal insulation of water piping system, bathtubs, thermo hydraulic systems, ecc.; applications where a good acoustical and/or electrical insulation is needed, insulating panels fixing which are of polystyrene, polyester extruded, cork, ecc.; sealing and filling of holes, cracks and cavities; junctions and sealings for works on roofs and walls; tiles consolidation, pasting of corrugated metal and tiles for roofing surfaces; particularly light and resistant in model-making. PU 2KF 09 is particularly suited any time an extremely rapid hardening product is required.

  • Expansion Ratio: 1:9
  • Density: 125 kg/m3
  • Mechanical Resistance: 0.2 N/mm²
  • Closed cell contents: > 90%
  • Water Absorption: 2.0% vol
  • Thermal Resistance: 0.04 W/(m*K)
  • Fire Resistance: self-extinguishing

Attachment

TDS PU 2KF 09_ENG

Description

PROPERTIES COMPONENT A COMPONENT B
CHEMICAL BASE Polyol MDI
COLOUR Natural Natural
DENSITY @ 25 °C 1,04 g/ml 1,20 g/ml
VISCOSITY @ 25 °C 800 mPa.s 800 mPa.s
MIXING RATIO BY VOLUME 1,00 1,00
MIXING RATIO BY WEIGHT 0,89 1,00
CHARACTERISTICS OF THE POLYMERIZED PRODUCT
APPLICATION TEMPERATURE +10 / +30 °C
GEL TIME (10 g @ 20°C) 3 sec
EXPANSION TIME (10 g @ 20°C) 15 sec
CUT AFTER (100 g @ 20°C) 3 min
POLYMERIZATION COMPLETED (10 g @ 20°C) 120 min
COLOUR White
APPEARANCE Foam
VISCOSITY 15.000
DENSITY 1,06 g/ml
HARDNESS Rigid
SERVICE TEMPERATURE – 36 / + 90 °C

Additional information

Type of joint (application mode)

≈ 100% of SURFACE

Adhesive Working Time

< 1 MINUTE

Adhesive Fixture Time

< 10 MINUTES

Type of failure mode (after joint stress)

ADHESIVE (bonding failure between adhesive and adhering: no residue on substrates), COHESIVE (bonding failure inside the adhesive: residue presence on substrates)

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