MK – MSP5

One component MS POLYMER moisture curing spatula – applied adhesive for full composite – floor bonding

Particularly suitable for bonding:

  • Bonding of plastic / metal module floors and wooden parquet
  • sealing of seams of welded sheets on horizontal surfaces
  • sealing of joints and overlapping parts
  • sealing of close joints
  • Free of isocyanates, solvents and silicones

Complies with CTBA adhesion test NFB 54-008 / EUROFINS low VOC emission test

Packaging: 7 kg bags – 200 Lt


Attachment

MK-MSP5 ENG

Description

PROPERTIES COMPONENT
CHEMICAL BASE SILANE-TERMINATED POLYURETHANE COMPOUND
CONSISTENCY POURABLE PASTE
DENSITY » 1,40 g/ml
VISCOSITY » 40.000 mPa.s
SHORE-A HARDNESS » 40° (ISO 868)
E-MODULUS AT 100 % » 1,20 MPa (ISO 37)
ELONGATION AT BREAK > 150 % (ISO 37)
SHEARING STRENGTH » 1,00 MPa (ISO 4587)
SKIN FORMING TIME » 40 min. (23°C & 50 % R.H.)
CURING SPEED » 3 mm / day (23°C & 50 % R.H.)
TEMPERATURE RESISTANCE -30 / +70°C
APPLICATION TEMPERATURE RANGE +15 / +35°C
COVERAGE 0,8 to 1,5 kg /m²
ACCESABILITY 24 h
CONFORM TO THE NORMS CTBA adhesion test NFB 54-008

EUROFINS low VOC emission test

Additional information

Specific work-setting (component)

DYNAMIC bonding-line > 100 cm (IMPACTS + VIBRATIONS + TORSIONS), Operating Temperature <0 ° C, STATIC bonding-line <100 cm (LIGHT HANDLING)

Type of joint (application mode)

≈ 100% of SURFACE

Substrates (suitable adherings match))

METALS and / or ALLOYS (Al – Ti – Ni – Cr – Fe) # HIGH ENERGY SURFACE THERMO-PLASTIC POLYMERS, METALS and / or ALLOYS (Al – Ti – Ni – Cr – Fe) # METALS and / or ALLOYS (Al – Ti – Ni – Cr – Fe), METALS and / or ALLOYS (Cu / Zn – Fe – Pb) # METALS and / or ALLOYS (Al – Ti – Ni – Cr – Fe), METALS and / or ALLOYS (Cu / Zn – Fe – Pb) # METALS and / or ALLOYS (Cu / Zn – Fe – Pb), WOOD # WOOD

Adhesive Working Time

30 ÷ 90 MINUTES

Adhesive Fixture Time

6 h ÷ 12 h

component sector/process

AUTOMOTIVE – TRUCK – BUS – AGRICULTURAL, FORESTRY MACHINES, FOOD, NAUTICAL & NAVAL

Type of failure mode (after joint stress)

ADHESIVE (bonding failure between adhesive and adhering: no residue on substrates), COHESIVE (bonding failure inside the adhesive: residue presence on substrates)

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