Description
Basic material                         Silyl Modified Polymer (SMP)
Curing method                         Moisture
Density                               ca. 1.4 g/ml
Skin Time                             ca. 10 minuti                    (20°C/50% R.H.)
Open Time                            < 15 minuti *                    (20°C/50% R.H.)
Curing speed after 24 hrs                ca. 3 mm             (20°C/50% R.H.)
Shore A hardness                       ca. 65 (DIN 53505)
Volume change                         < 3%                                 (DIN 52451)
Tensile stress (100%)                    ca. 2.1 MPa                      (DIN 53504/ISO 37)
Tensile stress at break                    ca. 3.2 MPa                      (DIN 53504/ISO 37)
Elongation at break                      ca. 250%                          (DIN 53504/ISO 37)
Tear propagation                        ca. 16 N/mm          (DIN 53515/ISO 34)
E-Modulus (10%)                                              ca. 3.3 MPa           (DIN 53504/ISO 37)
Solvents                               0%
Isocyanate percentage                    0%
Temperature resistance                  -40°C fino a +110°C
Application temperature                  +5°C fino +35°C
UV- and weather resistance               Excellent



