Description
Basic material Silyl Modified Polymer (SMP)
Curing method Moisture
Density ca. 1.5 g/ml
Skin Time ca. 10 minuti (20°C/50% R.H.)
Open Time < 15 minuti * (20°C/50% R.H.)
Curing speed after 24 hrs ca. 3 mm (20°C/50% R.H.)
Shore A hardness ca. 58 (DIN 53505)
Volume change < 3% (DIN 52451)
Tensile stress (100%) ca. 2.0 MPa (DIN 53504/ISO 37)
Tensile stress at break ca. 3.2 MPa (DIN 53504/ISO 37)
Elongation at break ca. 250% (DIN 53504/ISO 37)
Shear stress ca. 2.5 MPa (DIN 53283/ASTM D 1002)
Tear propagation ca. 16 N/mm (DIN 53515/ISO 34)
E-Modulus (10%) ca. 3.3 MPa (DIN 53504/ISO 37)
Solvents 0%
Isocyanate percentage 0%
Temperature resistance -40°C fino a +110°C
Application temperature +5°C fino +35°C
UV- and weather resistance Excellent